Field Emission Scanning Electron Microscope (FE-SEM) with Focused Ion Beam (FIB) Columns
The CIQTEK DB550 Focused Ion Beam Scanning Electron Microscope (FIB-SEM) has a focused ion beam column for nano-analysis and specimen preparation. It utilizes “super tunnel” electron optics technology, low aberration and non-magnetic objective design, and has the “low voltage, high resolution” feature to ensure its nanoscale analytical capabilities.
The ion columns facilitate a Ga+ liquid metal ion source with highly stable and high quality ion beams to ensure nanofabrication capabilities. The DB550 is an all-in-one nano-analysis and fabrication workstation with an integrated nano-manipulator, gas injection system, and user-friendly GUI software.
1. "Super Tunnel" electron optics column technology/in-column beam deceleration
Decrease spatial charging effect, ensuring low voltage resolution performance.
2. Crossover-free in the electron beam path
Effectively reduce lens aberrations and improve resolution.
3. Electromagnetic & electrostatic compound objective lens
Reduce aberrations, significantly improve resolution at low voltages, and enable observation of magnetic samples.
4. Water-cooled constant-temperature objective lens
Ensure the stability, reliability, and repeatability of the objective lens performance.
5. Variable multi-hole aperture switching system by electro-magnetic beam deflection
Automatic switching between apertures without mechanical motion allows fast switching among various imaging modes.
Resolution: 3 nm@30 kV
Probe current: 1 pA to 65 nA
Acceleration voltage range: 0.5 kV to 30 kV
Ion source exchange interval: ≥1000 hours
Stability: 72 hours of uninterrupted operation
Chamber internally mounted
Three-axis all-piezoelectrically driven
Stepper motor accuracy ≤10 nm
Maximum travel speed 2 mm/s
Integrated control system
Single GIS design
Various gas precursor sources available
Needle insertion distance ≥35 mm
Motion repeatability ≤10 μm
Heating temperature control repeatability ≤0.1°C
Heating range: room temperature to 90°C (194°F)
Integrated control system
>> Semiconductor
In the semiconductor industry, IC chips may encounter various failures. Various methods are used to analyze the chips to improve reliability. In particular, focused ion beam (FIB) analysis is a reliable analytical technique.
Specimen Characterization / Micro-Nano Fabrication / Cross-section Analysis / TEM Specimen Preparation / Failure Analysis
>> New Energy Industry
Observation and analysis of material cross-sections for research and process development.
Morphology Observation / Particle Size Analysis / Cross-section Analysis / Composition and Phase Analysis / Failure Analysis of Lithium-ion Battery Material / TEM Sample Preparation
>> Ceramic Material
Material analysis: The FIB-SEM system can perform high-precision micro-nano machining and imaging of ceramic materials, combined with various signal detection modes such as backscattered electrons (BSE), energy-dispersive X-ray spectroscopy (EDX), Electron Backscattered Diffraction Pattern (EBSD), and secondary ion mass spectrometry (SIMS), to study the material in micro to nano-scale with three-dimensional space in depth.
>> Alloy Material
To increase the strength, hardness, toughness, etc., of metals, other substances such as ceramics, metals, fibers, etc., are added into the metal using methods such as metallurgy, casting, extrusion, etc., which are called reinforced phases.
TEM specimen prepared by an FIB-SEM is used to observe information such as reinforced phases and boundary atoms through transmitted electron signals. TEM specimens can be used for transmission Kikuchi Diffraction (TKD) analysis, metallographic analysis, compositional analysis, and in-situ testing of alloy cross-section.
Highly integrated user interface platform
SEM microscope imaging and processing functions are integrated within an overall user interface, with comparative references displayed on the left and right.
Self-developed accessories hardware and user interfaces such as gas injection system and nano-manipulator, intuitive design of layout for easy-to-use operation.
Effectively reduce chamber contamination Linear guiding rail design, drawer-style opening and closing.
>> Energy Dispersive Spectrometry
>> Catholuminescence
>> EBSD
CIQTEK FIB-SEM Focused Ion Beam Scanning Electron Microscope |
CIQTEK FIB-SEM Practical Demonstration - TEM Sample Preparation |
CIQTEK FIB-SEM DB550 Specifications | ||
Electron Optics | Electron Gun Type | High Brightness Schottky Field Emission Electron Gun |
Resolution | 0.9 nm@15 kV; 1.6 nm@1 kV | |
Acceleration Voltage | 0.02 kV to 30 kV | |
Ion Beam System | Ion Source Type | Gallium |
Resolution | 3 nm@30 kV | |
Acceleration Voltage | 0.5 kV to 30 kV | |
Specimen Chamber | Vacuum System | Fully Automatic Control, Oil-free Vacuum System |
Cameras |
Three Cameras (Optical navigation x1 + chamber monitor x2) |
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Stage Type | Motorized 5-axis Mechanical Eucentric Specimen Stage | |
Stage Range |
X=110 mm, Y=110 mm, Z=65 mm T: -10°~+70°, R:360° |
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SEM Detectors and Extensions | Standard |
In-lens Electron Detector Everhart-Thornley Detector (ETD) |
Optional |
Retractable Back-Scattered Electron Detector (BSED) Retractable Scanning Transmission Electron Microscopy Detector (STEM) Energy Dispersive Spectrometer (EDS/EDX) Electron Backscatter Diffraction Pattern (EBSD) Nano-manipulator Gas Injection System Plasma Cleaner Specimen Exchange Loadlock Trackball & Knob Control Panel |
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User Interface | Languages | English |
Operating System | Windows | |
Navigation | Optical Navigation, Gesture Quick Navigation | |
Automatic Functions | Auto Brightness & Contrast, Auto Focus, Auto Stigmator |